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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD 000

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Update time: 2020-11-24 12:30:14
Creation time: 2016-05-05 14:31:05
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ID Name Designator Footprint Quantity
1 ADC574AJH U1 DIP28-600 1
2 74HC112EE U2 DIP 1
3 4.7K R1 R3 1
4 LED GREEN,YELLOW,RED,D1,D2,D3 LED3MM 6
5 220 R1,R2,R3 R3 3
6 MAX485 U1 DIL08 1
7 1k R1,R2,R3,R4,R5,R6,10 R3 7
8 MQ-2 U1 SNR6-D19.0MM 1
9 ADC0809 U2 DIP28W 1
10 AT89S52 U3 NONE 1
11 74LS90 U4 NONE 1
12 1u C7,C8 C1 2
13 DS18B20U U5 MSOP8 1
14 GREEN D1 LED3MM 1
15 RED D2 LED3MM 1
16 YELLOW D3 LED3MM 1
17 22PF C1,C2 C1 2
18 10k R4 R3 1
19 470 R5 R3 1
20 XTALfast 12MHZ 1X02 1
21 DS18B20 U5 MSOP8 1
22 100 R6 R3 1
23 BC807_16 S8550 SOT23 1

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