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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2020-09-21 18:05:06
Creation time: 2019-10-26 17:35:56
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ID Name Designator Footprint Quantity BOM_Supplier BOM_Supplier Part BOM_Manufacturer BOM_Manufacturer Part
1 1000uF C1 CAP-TH_BD10.0-P5.00-D1.0-FD 1 LCSC C346951 SamYoung Electronics NXA25VB1000M10*20_5.0TP
2 5EHDV-02P CN1,CN2,CN3 5EHDV-02P 3 LCSC C183515 Dinkle 5EHDV-02P
3 RelayHT3F-12VDC-SHG K1,K2,K3,K4 RELAY-TH_5PIN_HT3F-12VDC-SHG 4 LCSC C22022 HTV RelayHT3F-12VDC-SHG

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