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1.Easy to use and quick to get started

2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

Profession

1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

4.For enterprises, more professional users

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STD AFM_opu

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Update time： 2020-02-26 09:54:02
Creation time： 2019-07-01 08:31:07
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BOM
BOM download Purchase Parts
ID Name Designator Footprint Quantity
1 LW05202-45 FPC2 FPC-SMD_45PIN-PITCH0.50-BR_LW05202-45 1
2 2.2K R1,R28,R27 0603 3
3 10uF C1,C9,C11,C19 CAP-Z-5MMX11MM 4
4 Header-Male-2.54_1x4 H1 DIP-1X4P-2.54MM-M 1
5 47K R5 0603 1
6 18K R2,R12,R21 0603 3
7 TC4425AVPA U1 DIP8 1
8 Header-Male-2.54_1x3 P4,P5 HDR-3X1/2.54 2
9 33nF C2 0603 1
10 1uF C4,C5,C6,C7 0603 4
11 Header-Male-2.54_1x1 P1,P2,P3 HDR-1X1/2.54 3
12 22K R3,R4,R6,R7 0603 4
13 100nF C3,C8,C10,C20,C12,C15 0603 6
14 LMV321M5X/NOPB U2,U3 SOT-23-5 2
15 60 R26 2010 1
16 Header-Male-2.54_1x2 H2,H3 HDR-2X1/2.54 2
17 470 R8 0603 1
18 TLC2272CP U5 DIP-8 1
19 68K R13,R20 0603 2
20 39K R16,R23 0603 2
21 1.2K R9,R10,R17,R18 0603 4
22 56K R11,R19 0603 2
23 180K R14,R22 0603 2
24 10K R15,R24,R25 0805 3
25 22pF C14,C17,C18 0603 3
26 39pF C13,C16 0603 2
27 TLC2274AIDR U4 SOIC-14_150MIL 1

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