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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD AresENSEA-CDF-2020

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Update time: 2020-09-25 09:24:07
Creation time: 2019-10-10 14:18:51
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ID Name Designator Footprint Quantity
1 TSR_1-2450 U1 TSR-1-24120 1
2 811-S1-004-10-016101 J1,J2,J11,J10,J9,J13,J14,J8,J3,J4,J12 HDRV4W80P0X254_1X4_1016X254X70 11
3 310-87-106-01-640101 J16 SHDR6W50P0X254_1X6_1524X254X42 1
4 SL_3.5_2_180G J5,J6,J7,J15 SHDR2W120P0X350_1X2_840X750X11 4
5 MATRICE SHEMA U3 MATRICE 1
6 NucleoF401RE U2 NUCLEOF401 1
7 100u C2,C1 CAP-D3.0XF1.5 2
8 Pololu_Breakout_DRV8825 A1,A2 POLOLU_BREAKOUT-16_15.2X20.3MM 2
9 4k R1,R2,R3,R4 AXIAL-0.3 4
10 Header-Female-2.54_1x3 P1,P2,P3,P4 HDR-TH_3P-P2.54-V 4

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