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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2020-09-13 11:06:19
Creation time: 2019-09-16 03:51:31
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ID Name Designator Footprint Quantity
1 Header-Female-2.54_1x2 P2,P3 WJ2EDGVC-5.08-2P 2
2 2N2222 Q2 TO-92(TO-92-3F)-2.54 1
3 1u C13,C2 CAP-D5.0XF2.0 2
4 MC7812CTG U4 TO-92(TO-92-3F)-2.54 1
5 2500n C1 CAP-D5.0XF2.0 1
6 100n C3,C4,C5,C8,C9 RAD-0.1 5
7 6.8n C6,C7 RAD-0.1 2
8 1u C10,C11,C12 RAD-0.1 3
9 2N2222A Q1,Q5,Q6 TO-92(TO-92-3F)-2.54 3
10 100K R13,R16,R17,R22 POTENCIOMETRO 4
11 10k R1,R5,R6,R8,R11,R10,R19,R20 R1206 8
12 180k R2 R1206 1
13 56k R3 R1206 1
14 2k2 R4 R1206 1
15 1k R7,R12,R18 R1206 3
16 5.6k R9,R21 R1206 2
17 330 R14,R15,R23 R1206 3
18 1k R24,R25,R26 AXIAL-0.3 3
19 STW-6050-Z U1 ECM-6*5 1
20 TIP41C Q3,Q4,Q7 TO-220(TO-220-3) 3
21 WJ2EDGVC-5.08-2P P1 WJ2EDGVC-5.08-2P 1
22 DC005-2.0MM DC1 DC-5020 1
23 LM324APWR U2 DIP14 1
24 LM358 U3 DIP-8_L9.78-W6.60-P2.54-LS7.6-BL 1

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