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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2019-06-06 09:34:59
Creation time: 2019-06-06 07:21:10
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ID Name Designator Footprint Quantity
1 EL2 U1 NONE 1
2 EL1 EL1 NONE 1
3 EL3 U3 NONE 1
4 КЦ405А VD1 KBPC5010 1
5 VS1 D1 DO-35 1
6 VS2 D2 DO-35 1
7 VS3 D3 DO-35 1
8 VT3 Q1 TO-92(TO-92-3) 1
9 VT2 Q2 TO-92(TO-92-3) 1
10 VT4 Q3 TO-92(TO-92-3) 1
11 Header-Male-2.54_1x1 P1,P2,-,P3,+ HDR-1X1/2.54 5
12 300 R6,R5,R4 AXIAL-0.3 3
13 51 R8,R7 AXIAL-0.3 2
14 R6 51 AXIAL-0.3 1
15 К выв.7 DD1,DD2 . HDR-1X1/2.54 1
16 100 C2 RAD-0.1 1
17 100к R3 RES-ADJ_3386P 1
18 20к R2,R1 AXIAL-0.3 2
19 20мк*10В C1 CAP-D3.0XF1.5 1
20 КТ315Б VT1 TO-92(TO-92-3) 1
21 К155ЛА3 copy DD1 К155ЛА3 1
22 К155ТМ2 DD2 DIP14 1

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