© 2024 EasyEDA Some rights reserved ISO/IEC
1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD IPC_v1
License: GPL 3.0
Mode: Editors' pick
Indicado de posição para botoeira
ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Supplier Part | BOM_Manufacturer | BOM_Manufacturer Part |
---|---|---|---|---|---|---|---|---|
1 | 18.432Mhz | X1 | HC-49US_L11.0-W4.6-P4.88 | 1 | LCSC | C2191 | Raltron | A-3.579545-30-SL-TR |
2 | 10K | R4,R12,R3 | R0603 | 3 | LCSC | C267576 | Shenzhen Eyang Tech Development | R0603RXX202XF10LTS |
3 | 100R | R11,R10,R9,R13,R6,R8,R14 | R0603 | 7 | LCSC | C267576 | Shenzhen Eyang Tech Development | R0603RXX202XF10LTS |
4 | 10k | R1 | R0603 | 1 | LCSC | C267576 | Shenzhen Eyang Tech Development | R0603RXX202XF10LTS |
5 | 680R | R2 | R0603 | 1 | LCSC | C267576 | Shenzhen Eyang Tech Development | R0603RXX202XF10LTS |
6 | 1OK | R5 | R0603 | 1 | LCSC | C267576 | Shenzhen Eyang Tech Development | R0603RXX202XF10LTS |
7 | 1K | R7 | R0603 | 1 | LCSC | C267576 | Shenzhen Eyang Tech Development | R0603RXX202XF10LTS |
8 | BC817 | Q2,Q1 | SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR | 2 | LCSC | C8589 | CJ | BC817 |
9 | B120-13-F | D1,D2 | SMA_L4.3-W2.6-LS5.2-RD | 2 | LCSC | C134421 | Diodes Incorporated | B120-13-F |
10 | PIC16F628A-I/SO | U3 | SOIC-18_L11.6-W7.5-P1.27-LS10.3-BL | 1 | LCSC | C42089 | MICROCHIP | PIC16F628A-I/SO |
11 | Female header 2.54 1*5P | H1 | HDR-TH_5P-P2.54-V | 1 | LCSC | C46341 | ReliaPro | Female header 2.54 1*5P |
12 | 100uF | C11 | CAPACITOR ELETROLITICO 1UF | 1 | LCSC | C440818 | Rubycon | 450BXW47MEFR16X25 |
13 | 47uF | C10 | CAPACITOR ELETROLITICO 4MM | 1 | LCSC | C440818 | Rubycon | 450BXW47MEFR16X25 |
14 | FJ5101AG | DSP1,DSP2 | LED-SEG-TH_10P-L12.7-W19.0-P2.54-S15.24-BL | 2 | LCSC | C156236 | Shenzhen Zhihao Elec | FJ5101AG |
15 | Header-Male-2.54_1x4 | H2 | HDR-TH_4P-P2.54-V | 1 | LCSC | C124378 | Ckmtw | 210S-1*4P L=11.6MMGold-plated black |
16 | 47uH | L1 | IND-SMD_L5.7-W5.4 | 1 | LCSC | C475919 | cjiang(Changjiang Microelectronics Tech) | FXL1040-470-M |
17 | 100nF | C3,C4,C8,C9 | C0603 | 4 | LCSC | C730449 | SAMSUNG(三星) | CL10C270FB8NNNC |
18 | 10nF | C5 | C0603 | 1 | LCSC | C730449 | SAMSUNG(三星) | CL10C270FB8NNNC |
19 | 100nf | C6 | C0603 | 1 | LCSC | C730449 | SAMSUNG(三星) | CL10C270FB8NNNC |
20 | 100Nf | C7 | C0603 | 1 | LCSC | C730449 | SAMSUNG(三星) | CL10C270FB8NNNC |
21 | 27pF | C1,C2 | C0603 | 2 | LCSC | C730449 | SAMSUNG(三星) | CL10C270FB8NNNC |
22 | SN75176ADR | U1 | SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL | 1 | LCSC | C468242 | Texas Instruments | SN75176ADR |
23 | LM2594M-5.0/TR | U2 | SOP-8_L5.0-W4.0-P1.27-LS6.0-BL | 1 | LCSC | C316682 | HGSEMI | LM2594M-5.0/TR |
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