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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD PlatineV3

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Update time: 2021-05-25 12:38:22
Creation time: 2021-05-24 19:00:07
Description

Platine v3

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ID Name Designator Footprint Quantity BOM_Supplier BOM_Supplier Part BOM_Manufacturer BOM_Manufacturer Part
1 CRCW060310K0FKEA R5,R2,R3,R4,R1,R6,R7,R8,R9 R0603 9 LCSC C844918 Vishay Intertech CRCW060310K0FKEA
2 STM32F070F6P6 U1 TSSOP-20_L6.5-W4.4-P0.65-LS6.4-BL 1 LCSC C86951 STMicroelectronics STM32F070F6P6
3 100nF C1 C0603 1 LCSC C478888 火炬 C0603B104K500NT

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