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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2020-01-17 07:45:47
Creation time: 2019-12-06 15:22:25
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ID Name Designator Footprint Quantity BOM_Supplier BOM_Manufacturer BOM_Manufacturer Part BOM_Supplier Part
1 NE555P U1 DIP-8_L9.8-W6.6-P2.54-LS7.6-BL 1 LCSC TI NE555P C46749
2 10K R1 RES-TH_BD1.9-L3.3-P7.30-D0.5 1 LCSC YAGEO MFR-12FTE52-10K C172889
3 100nF C4 CAP-TH_BD4.0-P1.50-D0.8-FD 1 LCSC ValuePro 0.1uF 50V 4*7 C45664
4 DS-01BP SW1 SW-TH_DS-01BP 1 LCSC HRO DS-01BP C129067
5 470 R2 RES-TH_BD2.3-L6.5-P10.50-D0.5 1 LCSC Chian Chia Elec - C119317
6 DY-HIR323C U2 LED-TH_BD5.0-P2.54-FD 1 LCSC TONYU DY-HIR323C C459129
7 220uF C2 CAP-TH_BD8.0-P3.50-D1.0-FD 1 LCSC ValuePro 220uf/35V C2063
8 WJ2EDGVC-5.08-2P P1 WJ2EDGVC-5.08-2P 1 LCSC ReliaPro WJ2EDGVC-5.08-2P C8445
9 47K R4 RES-TH_BD2.3-L6.5-P10.50-D0.5 1 LCSC Chian Chia Elec - C120095

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