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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2019-10-26 15:02:25
Creation time: 2019-10-26 15:02:09
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ID Name Designator Footprint Quantity
1 L78L08ACD13TR@TME US5 SO8_M 1
2 L78L05ABD13TR@TME US6 SO8_N 1
3 ICL7660SCBA US7 INTS-SOIC-8_V 1
4 330nF C18 CAPC1608X90X35ML15T15 1
5 TLMS1000-GS08 D1 VISH-TLMS1000_V 1
6 282836-2@TME P1 TECO-282836-2_V 1
7 Cap Electrolytic C7 18 X 25MM RADIAL 7.5MM 1
8 5K1 R8 R1206 1
9 CL10B104KA8NNNC@TME C10,C11 0603 2
10 UUD1E470MCL1GS C12,C13,C9,C8 NIC-CAPA2-6.3X5.8_V 4

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