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Standard

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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD HiDev-microphone

License: GPL 3.0

Mode: Editors' pick

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Update time: 2021-02-03 20:59:30
Creation time: 2020-07-14 19:26:21
Description
http://hi-dev.ru/hi-dev-micro Attempt to create same project with SMD placed by JLCPCB Fied BOM and PnP files attached.
Design Drawing
schematic diagram
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PCB
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ID Name Designator Footprint Quantity BOM_Supplier BOM_Manufacturer BOM_Manufacturer Part BOM_Supplier Part
1 NE5532DR U1 SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL 1 LCSC TI NE5532DR C7426
2 47pF C5 C1206 1 LCSC FH 1206B471K500NT C1868
3 4.7uF C2,C3 C1206 2 LCSC MuRata GRM31CR71H475KA12L C77096
4 68K R2,R3 R0805 2 LCSC YAGEO RC0805JR-0768KL C137412
5 100K R4 R1206 1 LCSC UniOhm 1206W4J0104T5E C25647
6 1uF C1 C1206 1 LCSC MuRata GCM31MR71H105KA55L C85867
7 10uF C4 C1206 1 LCSC SAMSUNG CL31B106KAHNNNE C14860
8 4.7K R1 R1206 1 LCSC UniOhm 1206W4J0472T5E C26043
9 100K R6 RES-ADJ-SMD_G43BT 1 LCSC TOCOS G43BT-B104 C128149
10 1K R5 R1206 1 LCSC Uniroyal Elec 1206W4F1001T5E C52199

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