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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD MICRO

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Update time: 2020-03-24 03:25:12
Creation time: 2020-03-19 03:05:37
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ID Name Designator Footprint Quantity
1 22pF C1,C2 C0805 2
2 RRT H2 DIP-1X4P-2.54MM-M 1
3 OUT H3 DIP-1X4P-2.54MM-M 1
4 IR333C-A U4,U3,U5,U6 LED-5MM-2.54MM 4
5 ATMEGA328PB-AU U1 TQFP-32_L7.0-W7.0-P0.80-LS9.0-TL 1
6 FT232 H1 HDR-TH_6P-P2.54-V 1
7 150 R9,R12,R13,R14 R0805 4
8 L7805CD2T-TR U2 TO-263-2_L10.0-W9.1-P5.08-LS15.2-BR 1
9 47K R10,R11 R0805 2
10 Switch SW1 SW-SMD_L6.0-W3.6-P6.00-LS6.7 1
11 TSOP4838 LED5,LED1,LED2,LED3 SENSOR-TH_TSOP4X 4
12 20K R4 R0805 1
13 TB6612FNG U10 TB6612FNG 1
14 QRE1113GR U7,U8 OPTO-SMD_QRE1113GR 2
15 MMBT5551 Q1 SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR 1
16 1.8K R2 R0805 1
17 4.7uF C5,C6,C9,C10,C11,C12 C1206 6
18 16MHz X1 OSC-SMD_4P-L3.2-W2.5-BL 1
19 17-21SUYC/TR8 LED4,LED6 LED0805-RD 2
20 Header-Male-2.54_1x2 H4 HDR-2X1/2.54 1
21 VDG-02HG-R red DIP2 SW-TH_4P-L10.0-W6.6-P2.54-LS7.60 1
22 100nF C3,C4,C7,C8 C1206 4
23 SWP P1 WJ2EDGVC-5.08-2P 1
24 100 R5,R6,R7,R8 R0805 4
25 18 R1,R3 R1225 2

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