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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD preamp2

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Update time: 2020-10-14 03:42:53
Creation time: 2019-11-20 21:23:38
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ID Name Designator Footprint Quantity
1 MMBFJ112 Q1 SOT-23-3_L2.9-W1.6-P1.90-LS2.8-BR 1
2 10uF C5,C8,C9,C14 CAP-SMD_BD4.0-L4.3-W4.3-FD 4
3 1nF C1 C0805 1
4 .1uF C2 C0805 1
5 220nF C3,C10,C11 C0805 3
6 1n C4 C0805 1
7 1u C6,C7 C0805 2
8 10nF C12 C0805 1
9 80pf C13 C0805 1
10 10K R20,R21 POT7MM 2
11 1k R23 POT7MM 1
12 10M R1,R2 R1206 2
13 1.5K R3 R0805 1
14 1.5k R4 R0805 1
15 15k R5 R0805 1
16 150k R6 R0805 1
17 10K R7 R0805 1
18 1k R8,R17,R18,R19,R22,R24 R0805 6
19 4K7 R9,R10 R0805 2
20 100K R11,R12 R0805 2
21 2.7k R13 R0805 1
22 2.7K R14 R0805 1
23 300K R15,R16 R0805 2
24 1N5819_C82805 D1 DO-41_BD2.4-L4.7-P8.70-D0.9-RD 1
25 TL072SG-13 U1 SOIC-8_150MIL 1

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