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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2018-10-07 20:23:54
Creation time: 2018-10-06 15:33:20
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ID Name Designator Footprint Quantity Mounted
1 LM334S8#PBF U1 SOIC8 1 Yes C117189
2 LT3083IT#TRPBF U2 LT-T-5-S 1 Yes
3 OUT OUT HDR-1X1/2.54 1 Yes C81276
4 68R R1 0805 1 Yes
5 LT1009CDG4 U4 SOIC8 1 Yes
6 IN IN HDR-1X1/2.54 1 Yes C81276
7 2.2u C1 1206 1 Yes
8 1R R2 0805 1 Yes
9 10k R3,R4,R5,R6,R11,R13,R18 0805 7 Yes
10 100n C2,C3 0805 2 Yes
11 3.3k R7 0805 1 Yes
12 10k R8,R14 RES-ADJ_3386P 2 Yes C125022
13 1k R9,R10,R16 0805 3 Yes
14 12k R12 0805 1 Yes
15 2SC3356-T1B-A Q1 SOT-23(SOT-23-3)F 1 Yes C9659
16 15k R15 0805 1 Yes
17 LED-5MM LED1 LED-5MM/2.54 1 Yes C52721
18 470k R17 0805 1 Yes
19 22u C5 CAP-6.3*5.4 1 Yes
20 TLC2272AMD U3,U5 SOIC8 2 Yes

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