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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD Trassoiskatel

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Update time: 2022-03-23 18:35:39
Creation time: 2018-08-27 05:49:07
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ID Name Designator Footprint Quantity
1 Header-Female-2.54_1x2 P1,P2,P4 HDR-1X2/2.54 3
2 130 R2 0805 1
3 150k R1,R4 0805 2
4 470k R3 0805 1
5 120 R5 0805 1
6 430 R6 0805 1
7 75k R7 0805 1
8 100K R8,R10,R15 0805 3
9 10k R12 0805 1
10 0 R16 AXIAL-0.3 1
11 4,7 R13,R14 AXIAL-0.3 2
12 ICL7660CPAZ U5 DIP-8 1
13 10nF C16,C7,C3 0805 3
14 100nF C17,C23,C24,C6,C12,C13,C15,C22 0805 8
15 100nF(104) C18,C19 0805 2
16 220uF C21 CAP-D5.0XF2.0 1
17 100uF C14,C8 CAP-D5.0XF2.0 2
18 TDA2822L-D08-T U6 DIP-8 1
19 ASM1117 U3,U4 SOT223 2
20 10nF C5,C4,C2,C1 CAP-PTH-5MM 4
21 Rezistor_SchematicLib R11,R9 REZISTOR_1 2
22 10uF C20 CAP-D5.0XF2.0 1
23 1N4007 D1 SOD-123F 1
24 10uF C10,C11 CASE-B_3528 2
25 470uF C9 CAP-D8.0XF3.5 1
26 MCP6022T-I/SN U1,U2 SOIC-8_150MIL 2

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