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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
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STD Инфракрасная станция BGAArduino
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Update time：
2022-11-07 20:49:08
Creation time：
2018-08-06 22:16:57
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| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | load | 1,2,3,5,6 | WJ15EDGVC-3.81-2P | 5 |
| 2 | 5 | 4 | WJ15EDGVC-3.81-2P | 1 |
| 3 | diode_bridge | DM1,DM2,DM3,DM4,DM5,DM6 | DIODE_BRIDGE_BIG | 6 |
| 4 | 220 V in | IN | WJ15EDGVC-3.81-2P | 1 |
| 5 | Connector | P1 | HDR-20X1/2.54 | 1 |
| 6 | BTA16 | Q1,Q2,Q3,Q4,Q5,Q6 | TO-220(TO-220-3) | 6 |
| 7 | 510Ω(5100) | R1,R2,R3,R5,R6 | 1206 | 5 |
| 8 | 510 | R4 | 1206 | 1 |
| 9 | 10KΩ | R7,R8,R9,R10,R11,R12 | 1206 | 6 |
| 10 | 1K | R13,R14,R15,R16,R17,R18 | 1206 | 6 |
| 11 | 30KΩ(303) | R19,R20,R21,R22,R23,R24,R25,R26,R27,R28,R29,R30 | 1206 | 12 |
| 12 | PC817 | U1,U2,U3,U4,U5,U6 | DIP-4 | 6 |
| 13 | MOC3052 | U7,U8,U9,U10,U11,U12 | DIP-6 | 6 |
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