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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2021-04-22 08:11:53
Creation time: 2021-04-22 08:09:50
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ID Name Designator Footprint Quantity
1 1k R202,R102 AXIAL-0.3 2
2 10k R204 AXIAL-0.4 1
3 10k R203,R209,R208,R207,R107,R108,R109,R103,R104 AXIAL-0.3 9
4 100k R201,R216,R116,R101,R119,R219 AXIAL-0.3 6
5 10 R211,R111 AXIAL-0.3 2
6 4.7k R217,R218,R212,R112,R118,R117 AXIAL-0.3 6
7 22k R205,R206,R106,R105 AXIAL-0.3 4
8 100 R210,R215,R115,R110 AXIAL-0.3 4
9 1n C202,C102 CAP-5.5*8.5*3 2
10 47n C201,C101 CAP-5.5*8.5*3 2
11 15k R213,R113 AXIAL-0.3 2
12 33k R214,R114 AXIAL-0.3 2
13 2.2u C203,C103 RAD-0.1 2
14 100k VR1,VR2,VR4 RES-ADJ-TH_6PIN-H-L20.50-W16.00-PITCH5.00 3
15 50k VR3 RES-ADJ-TH_3PIN-H-L20.50-W16.00-PITCH5.00 1
16 Header-Male-2.54_1x3 H5,H6,H7 HDR-TH_3P-P2.54-V 3
17 27k R120,R220 AXIAL-0.3 2
18 8.2k R121,R221 AXIAL-0.3 2
19 150n C105,C205 RAD-0.1 2
20 2.2n C204,C104 RAD-0.1 2
21 SW U4,U5 SWITCHSILICONE 2
22 12k R122,R222 AXIAL-0.3 2
23 LED-3MM LED1 LED-3MM/2.54 1
24 2k R1 AXIAL-0.3 1
25 10uF C1,C2 CAP-TH_BD4.0-P1.50-D0.8-L-FD 2
26 NE5532P U1,U2,U3 DIP-8 3

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