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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2020-09-04 10:44:12
Creation time: 2017-08-24 12:58:32
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ID Name Designator Footprint Quantity
1 1k R3 AXIAL-0.4 1
2 WL102-341 U3 WL102-341 1
3 ATTINY45A-PU U4 DIP8 1
4 10k R4 AXIAL-0.4 1
5 100uF C2 CAP-D6.3XF2.5 1
6 100nF C3 0.1U CAPACITOR CERAMIC BLUE PLASTIC 1
7 LED D1 LED2-2.54-D5.0MM 1
8 8MHZ X1 OSC-49S-1 1
9 22pf C1,C4 RAD-0.1 2
10 DHT22 U1 DHT22_AM2303_VERT 1
11 10k R2 AXIAL-0.5 1
12 SIN(0 1 50) AC 1 0 V1 HDR1X2 1
13 SIP3 P1 HDR1X3 1
14 ESP8266-12F U1 LGA22-2.0-24X16MM_MIRROR 1
15 10k R3,R1,R2,R6 R3 4
16 100nF C1,C2 C1 2
17 SIP2 P2 HDR1X2 1
18 SSR G3MB-202P U2,U5 G3MB-202P 2
19 Connector KF301-2P U6,U7 CNT-KF301-2P 2
20 220v AC U8 CNT-KF301-2P 1
21 HLK-PM01 - AC-DC-converter U9 HLK-PM01-N 1
22 1N4007 D1,D2 DO-41 2
23 100k R4,R5 AXIAL-0.5 2
24 ams1117 AMS 2.54-1*3P_JX 1
25 333-2UYC/S530-A3 LED1,LED2,LED3 LED-5MM/2.54 3
26 FUSE F1,F2 FUSE TH 2A 2
27 WIRELESS-WL101-341 RF488 M3 WIRELESS-WL101-341 1

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