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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
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Update time：
2020-05-14 22:24:11
Creation time：
2020-04-30 13:11:02
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| ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Supplier Part | BOM_Manufacturer | BOM_Manufacturer Part |
|---|---|---|---|---|---|---|---|---|
| 1 | TL061 | U1 | DIP-8_L10.0-W6.5-P2.54-LS7.6-BL | 1 | LCSC | C116735 | Texas Instruments | TL061CP |
| 2 | 100n | C8,C6 | CAP-TH_L5.0-W2.5-P5.08-D0.7 | 2 | LCSC | C254099 | Dersonic | CC1H223ZC1SD3F4D30MF |
| 3 | 22n | C2,C4 | CAP-TH_L5.0-W2.5-P5.08-D0.7 | 2 | LCSC | C254099 | Dersonic | CC1H223ZC1SD3F4D30MF |
| 4 | 100u | C7,C5 | CAP-TH_BD6.3-P2.50-D1.0-FD | 2 | LCSC | C216321 | Changzhou Huawei Elec | KS1E101ME070A00CV0 |
| 5 | 6037 | +15V,-15V,VIN1,VIN2,VOUT1,VOUT2 | CONN-TH_6037 | 6 | LCSC | C238145 | Keystone | 6037 |
| 6 | 1.5k | R6 | RES-TH_BD5.0-L15.5-P19.50-D0.8 | 1 | LCSC | C479458 | FlyWin | MO2W-2K2±5%-9T73 |
| 7 | 68k | R5B,R3A,R5A,R3B | RES-TH_BD5.0-L15.5-P19.50-D0.8 | 4 | LCSC | C479458 | FlyWin | MO2W-2K2±5%-9T73 |
| 8 | 33k | R1 | RES-TH_BD5.0-L15.5-P19.50-D0.8 | 1 | LCSC | C479458 | FlyWin | MO2W-2K2±5%-9T73 |
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