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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD TDA2050x2

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Mode: Editors' pick

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Update time: 2019-07-14 15:26:53
Creation time: 2018-04-20 11:05:27
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ID Name Designator Footprint Quantity
1 TDA2050 U1,U2 TDA2050 2
2 1u C1,C8 CAP 5.08 2
3 0.1u C4,C3,C9,C10 CAP 5.08 4
4 0.47u 63V C7,C11 CAP 5.08 2
5 22k R1,R5,R9 1206 3
6 680 R2,R6 1206 2
7 2.2 1W R4,R8 2512 2
8 IN_L P3 CON 2.54 1X2 1
9 OUT_L P4 CON 2.54 1X2 1
10 HEATSINK H1,H2 HEATSINK TO220 2
11 470u 25V C5,C6,C12,C13 CAP-D8.0XF3.5 4
12 22u C2,C14 CAP-D5.0XF2.0 2
13 U_Input P5,P6 CON3 5.08 2
14 IN_R P1 CON 2.54 1X2 1
15 OUT_R P2 CON 2.54 1X2 1
16 50k R3,R7 RES-ADJ_3296W 2
17 OPT R10,R11 1206 2
18 Bridge SW1 VDG-01HG-R 1

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