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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2021-03-28 06:11:22
Creation time: 2018-07-27 04:12:02
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ID Name Designator Footprint Quantity
1 Header-Female-2.54_1x2 SQW,P1,PT2,PT1,LED 210S-1X2P 5
2 BC807-16 VT8 SOT-23(SOT-23-3) 1
3 1m L1,L2 CASE-B_3528 2
4 ATMEGA644PA-AUR U4 TQFP-44_10X10X08P 1
5 1N4148W D2 1206 1
6 220mF C101 CAP-D10.0XF5.0 1
7 1u C2,C8,C15,C4,C9,C20,C21,C10,C1,C303,C202 0805 11
8 irlml5203 Q10 SOT-23(SOT-23-3) 1
9 BC847 Q2 SOT-23(SOT-23-3) 1
10 Header-Male-2.54_1x4 UART DIP-1X4P-2.54MM-M 1
11 Header-Male-2.54_1x4 H2,I2C 210S-1X4P 2
12 DS3231 CLK1 DS3231 1
13 BC817-40 VT1,VT6,VT4,VT7,VT5,VT3 SOT-23(SOT-23-3) 6
14 Header-Male-2.54_1x3 XP4 210S-1X3P 1
15 10mF C12,C191,C19,C13,C17 CASE-B_3528 5
16 51k R6 RES-ADJ_3386P 1
17 1.5k R38 RES-ADJ_3386P 1
18 Header-Male-2.54_1x5 BUTTON 210S-1X5P 1
19 Header-Male-2.54_1x5 PORTS DIP-1X5P-2.54MM-M 1
20 BC857 Q1 SOT-23(SOT-23-3) 1
21 BUZZERHMB1275-12B BUZ6 DIP-BUZZER-12X7.5 1
22 Header-Male-2.54_2x5 XP3 HDR-5X2/2.54 1
23 Header-Male-2.54_1x1 PT3 210S-1X1P 1
24 560 R37 1206 1
25 1.5k R12,R16,R17,R22,R39,R15 1206 6
26 620 R13,R14,R4,R5,R2,R1,R3 1206 7
27 1 R18 1206 1
28 1k R19,R20,R8,R9,R10,R29 1206 6
29 470 R23 1206 1
30 910 R24 1206 1
31 2.4k R27 1206 1
32 10k R28,R33,R21 1206 3
33 1.2k R30,R32 1206 2
34 6.8k R31 1206 1
35 4.7k R40,R41 1206 2
36 56 R42,R7 1206 2
37 3k R25,R11 1206 2
38 Glass tube fuse2A 3F 250VAC F1 1206 1
39 LM358PSR U3 SOIC-8_208MIL 1
40 Header-Male-2.54_1x8 H3 210S-1X8P 1
41 12MHZ X2 OSC-49U-1 1
42 DSN-MINI-360 G1 DSN-MINI-360 1

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