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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
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STD Mobile UPS
Mode: Editors' pick
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Update time：
2019-05-08 03:21:18
Creation time：
2019-03-11 03:22:35
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| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | 2.2uF | C29,C30,C34,C1,C2,C6,C7,C58,C59,C63,C64,C8,C9,C13,C14,C15,C16,C20,C21,C22,C23,C27,C28,C35 | 1206 | 24 |
| 2 | SL1045 | D13,D1,D9,D2,D3,D7,D12 | TO-277A(SMPC) | 7 |
| 3 | 100KΩ(1003) | R34,R1,R41,R7,R17,R24 | 1206 | 6 |
| 4 | 6.98K | R36,R2,R42,R8,R18,R26 | 1206 | 6 |
| 5 | TPS54560DDAR | U4,U1,U7,U5,U2,U3 | SOIC-8_150MIL | 6 |
| 6 | 133K | R37,R3,R43,R9,R19,R27 | 1206 | 6 |
| 7 | 100nF | C31,C3,C60,C10,C17,C24,C46,C49,C39,C53 | 1206 | 10 |
| 8 | 56.2K | R38,R4,R44,R10,R20,R28 | 1206 | 6 |
| 9 | 510pF | C32,C4,C61,C11,C18,C25 | 1206 | 6 |
| 10 | 10uH | L5,L1,L7,L2,L3,L4 | IND-10104 | 6 |
| 11 | 169 | R39,R5,R45,R11,R21,R29 | 1206 | 6 |
| 12 | 10KΩ(103) | R40,R6,R32,R52,R12,R22,R30,R33,R53 | 1206 | 9 |
| 13 | 47uF | C33,C5,C62,C12,C19,C26 | CAP-D6.3XH5.5 | 6 |
| 14 | TPS55332QPWPRQ1 | U9,U6 | NONE | 2 |
| 15 | 30BQ060 | D10,D15,D16,D4,D5,D6 | SMC(DO-214AB) | 6 |
| 16 | 1nF | C42,C47,C36,C40 | 1206 | 4 |
| 17 | 10nF | C43,C44,C48,C37,C38,C41 | 1206 | 6 |
| 18 | 22uH | L8,L6 | 6025(0602) | 2 |
| 19 | 100K | R35,R13 | 1206 | 2 |
| 20 | 267K | R47,R14 | 1206 | 2 |
| 21 | 10K | R48,R15 | 1206 | 2 |
| 22 | 10.2K | R46,R16 | 1206 | 2 |
| 23 | 470nF | C50,C54 | 1206 | 2 |
| 24 | 49.9K | R49,R23 | 1206 | 2 |
| 25 | 4.99K | R50,R25 | 1206 | 2 |
| 26 | 2K | R51,R31 | 1206 | 2 |
| 27 | 2.2nF | C45,C55 | 1206 | 2 |
| 28 | HY19P03D | Q1,Q2,Q3 | TO-252-2(DPAK) | 3 |
| 29 | BZV55-C10 | D11,D8,D14 | SOD80C | 3 |
| 30 | Header-Male-2.54_1x2 | H7,H1,H4,H5,H6,H3 | HDR-2X1/2.54 | 6 |
| 31 | Header-Female-2.54_1x3 | P1 | HDR-3X1/2.54 | 1 |
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