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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2020-05-17 10:18:34
Creation time: 2020-03-11 17:41:08
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ID Name Designator Footprint Quantity BOM_Manufacturer Part BOM_Supplier Part
1 Header-Female-2.54_1x2 JP6 HDR-TH_2P-P2.54-V-M 1 2.54-1*2PFemale C49661
2 HEADERS_PINS1X10P_2.54MM_SMT COPY 6,5 PIN_HEADER_STRAIGHT_1X10_PITCH2.54MM_SMD_PIN1RIGHT 2 Headers  Pins1x15P 2.54mm T
3 Header-Male-2.54_1x6 3 HDR-TH_6P-P2.54-V 1 Header-Male-2.54_1x6 C37208
4 Header-Male-2.54_1x10 2 HDR-TH_10P-P2.54-V 1 Headers  Pins2.54mm1*10P C57369
5 0.10 R1 2010 1 RC2010FK-070R33L C22399
6 Header-Male-2.54_1x8 1,4 HDR-TH_8P-P2.54-V 2 210S-1*8P L=11.6MMGold-plated black C124381
7 Header-Male-2.54_1x2 JP6_1,JP6_2,SCK,MISO,MOSI HDR-TH_2P-P2.54-V 5 826629-2 C86471

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