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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD FCI-RS485-3

License: Public Domain

Mode: Editors' pick

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Update time: 2022-04-11 14:42:17
Creation time: 2021-12-15 14:56:45
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ID Name Designator Footprint Quantity BOM_Supplier BOM_Supplier Part BOM_Manufacturer Part
1 2.2uF C1,C2,C3,C4,C5 C0805 5 LCSC C237193 0805X225K100CT
2 EK500V-02P CN1 CONN-TH_EK500V-02P 1 LCSC C182802 EK500V-02P
3 IDC Box 2X12 2mm_C9129 P1 IDC-TH_24P-P2.00-C9129 1 LCSC C9129 IDC Box 2X12 2mm
4 1.3 R1,R10,R11,R12,R13,R14,R15,R16,R17 R0805 9 LCSC C101540 CR0805F81R30G
5 SS-1260 SW1 SW-TH_SS-1260 1 LCSC C589309 SS-1260
6 SP485EMN-L/TR U1 SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL 1 LCSC C916168 SP485EMN-L/TR
7 AZ23C2V7-7-F ZD1 SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR 1 LCSC C260925 AZ23C2V7-7-F

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