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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD sepic1

License: Public Domain

Mode: Editors' pick

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Update time: 2019-09-11 10:48:32
Creation time: 2019-09-11 06:43:02
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ID Name Designator Footprint Quantity
1 900 R1 AXIAL-0.4 1
2 4.7u C5 CAP-D6.3XF2.5 1
3 2SA1015-TA Q1 TO-92(TO-92-3)-2.54 1
4 10 R6 AXIAL-0.4 1
5 HY1906P Q2 TO-220FPAB 1
6 0.5 R7 AXIAL-0.6 1
7 10k R8 AXIAL-0.4 1
8 1N4148 D3,D1 DO-35 2
9 UC3843BNG U2 DIP-8 1
10 Header-Female-2.54_1x2 P1 HDR-1X2/2.54 1
11 10K R4,R3 AXIAL-0.4 2
12 1k R5,R2 AXIAL-0.4 2
13 1m L1 AXIAL-0.6 1
14 220 C2 RAD-0.1 1
15 470 C3 RAD-0.1 1
16 20n C1 RAD-0.1 1
17 2n2 C4 RAD-0.1 1

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