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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
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STD WARMER 2021 REV C
License: null
Mode: Editors' pick
Cloned from WARMER 2021
- 0
Update time：
2021-11-23 16:05:04
Creation time：
2021-11-22 17:45:12
Description
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| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | 874370243 | BATTERY,HEATER,NTC | CONN-SMD_874370243 | 3 |
| 2 | 0.1u | C1,C2,C12 | C0603 | 3 |
| 3 | 10uF | C3,C6,C11 | C0805 | 3 |
| 4 | 100nF | C4,C5,C10 | C0805 | 3 |
| 5 | 100nF | C8,C9 | C0603 | 2 |
| 6 | 100uF | C13 | CAP-TH_BD5.0-P2.00-D0.8-FD | 1 |
| 7 | FM4007 | D2 | SOD-123FL_L2.7-W1.8-LS3.8-RD | 1 |
| 8 | DC-182-25A | DC1 | DC-IN-SMD_DC-182-25A | 1 |
| 9 | HDR-M-2.54_1x1 | J1,J2,J3,J4,J5 | HDR-M-2.54_1X1 | 5 |
| 10 | ESP32-SL | L1 | WIFIM-SMD_ESP32-SL | 1 |
| 11 | led Green | LED2,LED3,LED4 | LED1206-RD | 3 |
| 12 | SLR0522DYA3BD | LED5 | LED-SEG-TH_10P-L25.0-W17.5-P2.54-S14.8-BL | 1 |
| 13 | S8050-G_C164892 | Q1,Q2,Q3 | SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR | 3 |
| 14 | AOD4184A | Q5 | TO-252-2_L6.6-W6.1-P4.57-LS9.9-TL-CW | 1 |
| 15 | 100 | R1,R5,R14 | R1210 | 3 |
| 16 | 1K | R2,R3,R4,R6,R13,R15 | R0805 | 6 |
| 17 | 100 | R9,R11 | R0603 | 2 |
| 18 | 10K | R10,R12,R16 | R0603 | 3 |
| 19 | 470 | R17 | R0603 | 1 |
| 20 | 220 | R18,R19,R20,R21,R22,R23,R24,R25,R26 | R0805 | 9 |
| 21 | K5-1664DA-01 | SW1 | SW-TH_K5-1664DA-01 | 1 |
| 22 | RH6015CF | U1,U2,U4 | TDFN-6_L2.0-W2.0-P0.65-BL | 3 |
| 23 | HT7733B_C259930 | U3 | SOT-23-3_L2.9-W1.6-P1.90-LS2.8-BR | 1 |
| 24 | XL1509-3.3 | U5 | SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL | 1 |
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