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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2021-03-21 13:34:49
Creation time: 2019-07-08 20:16:24
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ID Name Designator Footprint Quantity
1 Vin P1,P3 HDR-1X2/2.54 2
2 load P4 HDR-1X2/2.54 1
3 Vin P5 PAD-JUMPER-2-NO_YES_SILK 1
4 spkr P6 PAD-JUMPER-2-NO_YES_SILK 1
5 Ain P7 PAD-JUMPER-2-NO_YES_SILK 1
6 1N4448 D1,D2 DO-35 2
7 1k R8,R5,R6 AXIAL-0.3 3
8 TDA2822 U4 SOP-8_150MIL 1
9 load P2 HDR-4X1/2.54 1
10 NE555P U3 DIP-8_LS7.62-L9.78-W6.60-PITCH2.54 1
11 100 R7 RM065-V1 1
12 1u C9 CAP-D3.0XF1.5 1
13 10u C11 CAP-D3.0XF1.5 1
14 Tune H1 HDR-5X1/2.54 1
15 OpAmp U1 DIP-8 1
16 100pF C3 CAP-HV-5.5*2.5 1
17 CS1N60 Q1 TO-92(TO-92-3) 1
18 100pf C4,C5,C6 CAP-HV-5.5*2.5 3
19 10n C10 CAP-0603 1
20 100n C12,C13 CAP-0603 2
21 78L05 U2 TO-92 1
22 150k R1 AXIAL-0.3 1
23 7.5k R2 AXIAL-0.3 1
24 4.7 R9,R10 0603 2
25 22uF C1,C2 EL. CAP. 10UF 50V 2
26 100nf C7,C8 CAP-HV-5.5*2.5 2

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