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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD ESP_Palo_Cerpadlo

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Update time: 2020-06-04 05:43:50
Creation time: 2019-08-09 11:22:28
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ID Name Designator Footprint Quantity
1 Mini DC-DC Step Down U3 MINI DC-DC 12-24V TO 5V 3A STEP-DOWN 1
2 100uF C2 CAP-D6.3XH7.7 1
3 10K R1,R2 0603 2
4 100K R3,R4 0603 2
5 Header-Male-2.54_1x4 H-MOST,UART,I2C DIP-1X4P-2.54MM-M 3
6 IRLL2705TRPBF Q1,Q2 SOT-223 2
7 100 RN2,RN1,RN3,RN4 0603_X4 4
8 ESP32-DEVKITC-32D_ESP32-DEVKITC-32D U1 MODULE_ESP32-DEVKITC-32D 1
9 Vstup IN MKDS1/2-3.5 1
10 Motor MOTOR1,MOTOR2 MKDS1/2-3.5 2
11 I2C IO,ANALOG,12V,3,3V,GND,IO2 MKDS1/4-3.5 7
12 RCLAMP0504F.TCT D4,D2,D6,D7 SC-70-6_L2.2-W1.3-P0.65-LS2.1-BL 4
13 ER2J_R1_00001 D1,D3 SMB(DO-214AA) 2
14 SMAJ15A-TR D5 SMA_L4.4-W2.6-LS5.0-RD 1
15 10uF C1 0805 1

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