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1.Easy to use and quick to get started

2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

Profession

1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

4.For enterprises, more professional users

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STD UTS Light

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Mode: Editors' pick

Cloned from UTS Light

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Update time: 2021-04-17 10:33:55
Creation time: 2019-08-28 07:03:13
Description
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ID Name Designator Footprint Quantity
1 CREEXPE HEATSINK D11,D12,D13,D14,D15,D8,D9,D10,D4,D5,D6,D7,D16,D17,D1,D2,D3,D18 CREEXPE HEATSINK 18
2 1 uF C1,C2 1206 2
3 SS16T3G D20,D19 ON_SEMI_DIODE 2
4 MAX16832A U1,U2 SOIC-8_150MIL 2
5 P4 WHTPWR2 SOLDER_PAD 1
6 P3 WHTPWR1 SOLDER_PAD 1
7 P2 REDPWR2 SOLDER_PAD 1
8 P1 REDPWR1 SOLDER_PAD 1
9 P9 DIM1 SOLDER_PAD 1
10 P10 DIM2 SOLDER_PAD 1
11 P6 COM2 SOLDER_PAD 1
12 P5 COM1 SOLDER_PAD 1
13 1K R2,R1 0805 2
14 P8 CATHODE SOLDER_PAD 1
15 P7 ANODE SOLDER_PAD 1
16 1206 JUMPER J2,J3,J4,J6,J1 1206_JUMPER 5
17 REDI REDI1,REDI2 SOLDER_PAD 2
18 FUSE F1,F2 1206_JUMPER 2
19 330 uH L2 COILCRAFT LPS8045 1
20 10uH L1 COILCRAFT LPS8045 1

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