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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2019-10-15 13:22:24
Creation time: 2019-09-26 13:46:57
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ID Name Designator Footprint Quantity
1 1k R1,R2,R3,R4 AXIAL-0.4 4
2 220 R5,R6,R7,R8 AXIAL-0.4 4
3 1u C1,C2 CAP-D6.3XF2.5 2
4 BC547B Tube Q1,Q2,Q3,Q4 TO-92_3PIN-L4.95-W3.94-PITCH2.54-L 4
5 LM7805EE U2 TO-220 1
6 1N4007 D1,D2,D3,D4 DO-41 4
7 Screw Terminal J1,J2,J3,J4,J5 H2-5.0-10.5X8.0MM 5
8 SW_PUSH_DPDT SW1 SW_PUSH_BUTTON_MINI 1
9 333-2SURD/S530-A3 LED1,LED2,LED3,LED4 LED-TH_BD5.9-P2.54-RD 4
10 DC005-2.5MM DC1 DC-5020 1
11 NodeMCU-32SLua U1 NODEMCU-32SLUA 1
12 Omron-G5LE-Relay_SPDT RL1,RL2,RL3,RL4 OMRON_G5LE_SPDT_RELAY 4

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