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This boards should provide SPI I/O expansion based on the MCP23S17. The boards should be stackable since the layout of the SPI connector is the same for all boards. The Digital Input and the Digital Relay Output are galvanically isolated. Prototype has been tested with a Teensy 3.2 but any other SPI capable processor should work. All In and Out power supply must be provided by external power supply since only the non isolated part is powered by the processor power.







ID Name Designator Footprint Quantity BOM_Manufacturer Part BOM_Supplier BOM_Supplier Part
1 MCP23S17-E/SP U1,U2,U9 DIP-28_300MIL 3 MCP23S17-E/SP LCSC C148096
2 2.54mm 2*20PFemale header P1,P2,P3 HDR-20X2/2.54 3 2.54mm 2*20PFemale header LCSC C50982
3 MF-R005-0-99 F1 F-0.05A 1 MF-R005-0-99 LCSC C89659
4 100nF C1,C2,C3 CAP-0.2 3 CT4-1206B104K251F3 LCSC C93117
5 210S-2*4P L=11.6MMGold-plated black H1,H2,H3 DIP-2X4P-2.54MM-M 3 210S-2*4P L=11.6MMGold-plated black LCSC C124386
6 1KΩ RN1,RN2 SIP-9 2 A09-102JP LCSC C9111
7 ULN2803APG U3,U4 DIP-18 2 ULN2803APG LCSC C5252
8 A16-400 F2 F-4.00A-16V 1 A16-400 LCSC C135392
9 210S-1*3P L=11.6MMGold-plated black AG2,AA2,A+2,AG,AA,A+,AG1,AA1,A+1 DIP-1X3P-2.54MM-M 9 210S-1*3P L=11.6MMGold-plated black LCSC C124376
10 RL16-400 F3,F4 F-4.00A-16V 2 RL16-400 LCSC C20839
11 AQY210EH K0,K1,K2,K3,K4,K5,K6,K7,K8,K9,K10,K11,K12,K13,K14,K15 DIP-4 16 AQY210EH LCSC C13541
12 300 R8,R9,R10,R11,R12,R13,R14,R15,R0,R1,R2,R3,R4,R5,R6,R7 RES_0603 16 AR03DTC3000 LCSC C374566
13 LTV-847 U5,U6,U7,U8 DIP-16_W7.62MM 4 LTV-847 LCSC C10794




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