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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2021-04-11 00:48:09
Creation time: 2017-06-07 01:59:51
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ID Name Designator Footprint Quantity
1 LM2596SX-5.0/NOPB U1 TO-263-5 1
2 15.0uF 5V-CIN 0805 1
3 SS24F 5V-D1 SMAF 1
4 2.2uF C4,C5,C8 1206 3
5 22uF C1A,C2A,C1B,C2B 1206 4
6 1uF C3,C6 1206 2
7 47nF C7 0603 1
8 453K R1 0805 1
9 232K R2 0805 1
10 0.1uF C9,C10 0805 2
11 107K R3 0805 1
12 MBR0520LT1G D1 SBR3U100LP-7 1
13 MBR0520LT1G D2 USP140 1
14 287K R4,R7 0805 2
15 20K R5,R6 0805 2
16 1X4-3.5MM CN1 1X04-3.5MM 1
17 DC-005_1 VIN-+12V DC-5020 1
18 47uH 5V-L1 MSS1583-473MEB 1
19 330uf 5V-COUT EEE-FK1V331P 1
20 15uH L3 744025 150 1
21 12uH L2 MSS1038-123 1
22 LT7481 U3 lt7481 1
23 DRQ74-150-R L1 DRQ74-150-R 1

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