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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2021-11-22 19:02:35
Creation time: 2016-06-28 12:11:34
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ID Name Designator Footprint Quantity
1 100u C1 CP_8X13MM 1
2 1N4148 D1,D2 DO35-10 2
3 ESP01 ESP8266 ESP01 1
4 AC IN J1 H2-5.0-10.5X8.0MM 1
5 AC OUT J2 H2-5.0-10.5X8.0MM 1
6 CMD J3,J4 H3-5.0-15.5X8.0MM 2
7 SIP2 P1 HDR1X2 1
8 4.7K R1,R2 020712 2
9 10K R3,R4 020712 2
10 RELAY RELAY1,RELAY2 SRD-05VDC-SL-C 2
11 2N2222 T1,T2 TO18 2
12 LM1117 U1 TO252 1

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