Title: | QFN-28_L5.0-W5.0-P0.50-BL-EP-THERMAL-PAD |
Package: | QFN-28_L5.0-W5.0-P0.50-BL-EP-THERMAL-PAD |
Description: | Adds vias and a bottom exposed copper pad for thermal dissipation. See here for info: https://easyeda.com/forum/topic/How-to-avoid-DRC-errors-when-connecting-to-PCB-Footprints-a-k-a-PCB-Libs-90bf944fe3644b21a7d27a9e9d8df8d6 |