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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2022-10-05 11:57:17
Creation time: 2018-02-12 07:15:25
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ID Name Designator Footprint Quantity
1 MTP125-1102S1 5-24V,IR-DATE HDR-TH_2P-P2.54-V 2
2 LDR/PHOTORESISTOR/PHOTOCELL, 3kΩ-11kΩ, 5.10MM ADC RES-TH_L5.1-W4.3-P3.40-D0.5 1
3 Beeper_5v BEEPER_5V BEEPER_HC1206A_HC0905F 1
4 220u C3 C1210 1
5 10uF C4 C0402 1
6 100nF C5 C0402_NEW 1
7 680u C6 C1210 1
8 LED D2 LED3MM 1
9 BZT52C10 D3 SOD123 1
10 DHT22 DHT22 SENSOR-TH_HAIGU_DHT22 1
11 ESP8266 ESP8266 WIFIM-SMD_ESP-12F-ESP8266MOD 1
12 68u L2 INDUCTOR-1206 1
13 SIP1 P3 HDR1X1 1
14 RJ-45 POE JACK 8-8 1
15 10k R1 C1206 1
16 10k R1-10K,R2-10K,R3-10K R0603 3
17 100k R2 TRIM_POT_PTH 1
18 1k R3 C0805 1
19 4.7k R4-4.7K,R11-4.7K,R12-4.1K,R12-4.2K,R12-4.3K,R12-4.7K R0603 6
20 MTP125-1104S1 TTL,U6 HDR-TH_4P-P2.54-V-M 2
21 IR U1 TSOP18XX 1
22 BMP180 U2 BMP180 1
23 LM2596S-ADJ U4 TO263-5 1
24 USB-255-BRWH150 USB1 USB-A-TH_USB-256-BRWH130 1
25 AMS1117-3.3 AMS1117-3 SOT-223-3_L6.5-W3.4-P2.30-LS7.0-BR 1
26 120pF C1,C2 C1206 2
27 100nF C7,C9 C1206 2
28 10nF C8 C1206 1
29 47uF C10,C11 CAP-TH_BD8.0-P3.50-D1.0-FD 2
30 10uF C12 CAP-TH_BD5.0-P2.00-D0.8-FD 1
31 PESD5V0S1BA,115 D1 SOD-323_L1.8-W1.3-LS2.5-RD 1
32 C88860-000 F1 F1206 1
33 043702.5WR1 F2 F1206 1
34 15uH L1 IND-SMD_L11.5-W10.5 1
35 100K R5 R1206 1
36 19.1K R6 R1206 1
37 3.74K R7,R8 R1206 2
38 43.2K R9 R1206 1
39 220K R10 R1206 1
40 TPS54336ADDAR U3 HSOP-8_L5.0-W4.0-P1.27-LS6.2-BL-EP 1

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