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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD Datalogger

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Update time: 2020-03-14 22:10:57
Creation time: 2016-12-12 22:19:28
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ID Name Designator Footprint Quantity
1 PIC18F258 U1 SO-28W 1
2 SD Card Breakout Board U3 SD Card KGN 2 1
3 PCA82C251TD U4 SOIC-8 1
4 120Ω R1,R2 1210 2
5 7805 U6,U7 TO252 2
6 SIP6 P1 HDR1X6 1
7 12M XTAL1 HC-49U-PTH 1
8 8M XTAL2 HC-49U-PTH 1
9 15pF C4,C5 C805 2
10 0.1uF C6,C9,C11,C2 C805 4
11 4.7K R4 R805 1
12 0.01uF C7,C8 C805 2
13 1K R5 R805 1
14 30pF C10 C805 1
15 47K R10 R805 1
16 2200uF 6V C12,C1 CAP-D10.0XF5.0 2
17 PH-4A P6,P2,P4,P5 PH-4A 4
18 1N4007 D5,D1 SMB 2
19 DS12887 U5 DIP24-600-ENDIP24A 1
20 SM8S33AHE3/2D D3 SMC 1
21 2 Pole DIP Switch S1 DIP4 1
22 FUSEX20MM F2 FUSE Holder 5MM 1
23 47uF 50V C13 CAP-D10.0XF5.0 1
24 CH375B U2 SOIC-28_300mil 1
25 Header-Male-2.54_1x2 P3 HDR-2X1/2.0 1
26 deleted C3,C14 C805 2

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