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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2021-01-20 03:10:29
Creation time: 2016-10-10 19:45:31
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ID Name Designator Footprint Quantity
1 SIN(0 1 50) AC 1 0 V1 2P-5.0 1
2 GBJ15005 B1 NONE 1
3 XFMR T1 NONE 1
4 LM7812EE U1 TO220 1
5 5000uF C1 CP_8X13MM 1
6 SPST_ON S1 TACTILE-PTH 1
7 100k R1 TRIM_POT_PTH 1
8 LED D1 LED3MM 1
9 10k R2 R3 1
10 47n C1,C2,C3,C4 2.5mm ceramic cap 4
11 1000u C5 CP_8X13MM 1
12 LM317 U1 TO220 1
13 10u C7 CP_8X13MM 1
14 1N4002 D1 DO35-7 1
15 2k R1,R4 R3 2
16 274 R2 R3 1
17 6k81 R3 R3 1
18 1N4001 D2 DO35-7 1
19 470u C8 CP_8X13MM 1
20 100nF C10,C11 CERAMIC-2.54 2
21 GBJ15005 B1 Bridge Rectifier SIL 1
22 Screw Terminal J1,J2 H2-3.5-7.0X7.0MM 2
23 FUSE F1 FUSE-5X20-PCB 1
24 SWITCH-SPSTPTH2 S1 SWITCHE-DPDT 1
25 1000u C2,C3,C4 CPOL-RADIAL-10UF-25V 3
26 7812 UP1 RPACK-SIP-PTH-5 1
27 7912 UP2 RPACK-SIP-PTH-5 1
28 CON3 J2 RPACK-SIP-PTH-5 1
29 OUT J RPACK-SIP-PTH-5 1
30 1000u C5 CPOL-RADIAL-1000UF-63V 1
31 104p C6,C7 CPOL-RADIAL-1000UF-63V 2
32 BRIDGE1 D2 RPACK-SIP-PTH-5 1

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