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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2019-09-01 03:50:49
Creation time: 2019-08-31 12:24:05
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ID Name Designator Footprint Quantity BOM_Supplier BOM_Manufacturer BOM_Manufacturer Part BOM_Supplier Part
1 TIP3055 Q1 TO-247(AC) 1 LCSC STMicroelectronics TIP3055 C48859
2 TIP2955 Q2 TO-247 1 LCSC STMicroelectronics TIP2955 C262991
3 2.2K R1 AXIAL-9.0X3.3 1 LCSC YAGEO MFR1WSJT-52-2K2 C176422
4 2K R2 AXIAL-9.0X3.3 1 LCSC YAGEO MFR1WSJT-52-2K C176421
5 4.7k R3 AXIAL-9.0X3.3 1 LCSC YAGEO MFR1WSJT-52-2K C176421
6 1N4007 D1,D2 DO-41 2 LCSC LRC 1N4007 C78540
7 220uF C1 CAP-TH_BD10.0-P5.00-D1.0-L-FD 1 LCSC ValuePro 220uF 50V 10*13 C45105
8 C945 Q3 TO-92(TO-92-3) 1 LCSC CJ C945 C9630
9 4.7uF C2 CAP-D10.0XF5.0 1 LCSC ValuePro 4.7uF 450V 10*13 C46884
10 100 R4 AXIAL-0.8 1 LCSC Chian Chia Elec - C120762
11 Header-Female-2.54_1x2 P1,P2,P3,P4 HDR-1X2/2.54 4 LCSC BOOMELE 2.54-1*2PFemale C49661

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