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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD pour_imprime

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Update time: 2022-01-06 23:14:28
Creation time: 2020-01-12 12:14:17
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ID Name Designator Footprint Quantity
1 1N4448 D3,D5 DO-35 2
2 USB RJ1 RJ11-1 1
3 10k R6,R5,R7,R8 AXIAL-0.3 4
4 5k6 R2,R4 AXIAL-0.3 2
5 10u/10v C4,C3 CAP-D3.0XF1.5 2
6 DOWN J5 H3-5.0-15.5X8.0MM 1
7 UP J4 H3-5.0-15.5X8.0MM 1
8 SANSOR H1 HDR-TH_3P-P2.54-V 1
9 Flash SW2 KEY-6.0*6.0-4 1
10 Reset SW1 KEY-6.0*6.0-4 1
11 ESP8266-12F U2 LGA22-2.0-24X16MM 1
12 BC547 Q1,Q2 TO-92(TO-92-3) 2
13 L P3 HDR-1X1/2.54 1
14 5V P5 HDR-1X1/2.54 1
15 GNG P6 HDR-1X1/2.54 1
16 N P4 HDR-1X1/2.54 1
17 INTERRUPTEUR DIP1 VDG-02HG-R 1
18 220v J1 H2-5.0-10.5X8.0MM 1
19 BTN2 J2 H2-5.0-10.5X8.0MM 1
20 BTN1 J3 H2-5.0-10.5X8.0MM 1
21 DOWN RL2 OMRON_G5LE_SPDT_RELAY 1
22 UP RL1 OMRON_G5LE_SPDT_RELAY 1
23 LM1117-3.3V U9 TO-220(TO-220-3) 1
24 100n C9,C1,C2 RAD-0.1 3

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