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1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
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ID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | SIP2 | 3 | PCB 2pole screw terminal block 2.54 | 1 |
2 | MOUDLE-WIFI-ESP8266-12E-ESP-12E(22P-24X16MM) | U1 | Esp8266 Module | 1 |
3 | 10k | R1 | R3 | 1 |
4 | 1u | C1 | C1 | 1 |
5 | 100R | R2 | R3 | 1 |
6 | 1k | R3,R7,R8 | R3 | 3 |
7 | Flash | P1 | HDR1X2 | 1 |
8 | USB/TTL | P2 | HDR1X3 | 1 |
9 | SSR G3MB-202P | U2 | G3MB-202P | 1 |
10 | SSR G3MB-202P | U3 | G3MB-202P | 1 |
11 | MAINS | P3 | PCB 3pole screw terminal block 2.54 | 1 |
12 | 47k | R4,R5 | R3 | 2 |
13 | 4.7k | R6 | R3 | 1 |
14 | Teclas | P4 | PCB 3pole screw terminal block 2.54 | 1 |
15 | 2N2222A | Q3,Q4 | TO-92 | 2 |
16 | SIP3 | TEMPERATURA | PCB 3pole screw terminal block 2.54 | 1 |
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