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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2020-09-11 15:51:58
Creation time: 2019-09-23 13:16:20
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ID Name Designator Footprint Quantity
1 22uF C2 CAP-D3.0XF1.5 1
2 10uF C3 CAP-D3.0XF1.5 1
3 NE555P U1 DIP-8_LS7.62-L9.78-W6.60-PITCH2.54 1
4 3MMHOLE_PTH OUT,GND,V+ 3MMHOLE_PTH 3
5 204-10SURD/S530-A3 LED2,LED1 LED-3MM/2.54 2
6 100nF C6,C5 RAD-0.1 2
7 10nF C4 RAD-0.1 1
8 1uF C1 RAD-0.1 1
9 LM7809EE U2 TO220 1
10 1k R1 AXIAL-0.3 1
11 68k R2 AXIAL-0.3 1
12 2k R3 AXIAL-0.3 1
13 510k R4 AXIAL-0.3 1
14 820ohm R5 AXIAL-0.3 1
15 20k R6 AXIAL-0.3 1
16 18k R7 AXIAL-0.3 1
17 5.1k R8 AXIAL-0.3 1
18 10k R9 AXIAL-0.3 1
19 51ohm R10 AXIAL-0.3 1
20 TRIMPOT FREQ R11 TRIMPOT_5MM 1
21 TRIMPOT HI R12 TRIMPOT_5MM 1
22 TRIMPOT LOW R13 TRIMPOT_5MM 1

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