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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2019-07-27 12:00:53
Creation time: 2019-07-08 16:23:15
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ID Name Designator Footprint Quantity
1 1k R1,R3,R11,R12 AXIAL-0.3 4
2 1u C1,C2 RAD-0.1 2
3 510k R2 AXIAL-0.3 1
4 300 R4,R13 AXIAL-0.3 2
5 LM7908EE U2 TO220 1
6 LM7808EE U3 TO220 1
7 LM7905EE U4 TO220 1
8 LM324N U5 DIP-14_LS7.97-L19.94-W7.19-PITCH2.54 1
9 M74HC4066B1R U6,U7 DIP14 2
10 10k R5 AXIAL-0.3 1
11 4k R6 AXIAL-0.3 1
12 400 R7 AXIAL-0.3 1
13 100 R8 AXIAL-0.3 1
14 5k R9 AXIAL-0.3 1
15 2k R10 AXIAL-0.3 1
16 Header-Male-2.54_1x4 H1 DIP-1X4P-2.54MM-M 1
17 Header-Male-2.54_1x3 P2,P1 HDR-3X1/2.54 2
18 Header-Male-2.54_1x2 H2 HDR-2X1/2.54 1
19 LM324SNG U1 DIP-14_300MIL 1

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