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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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Profession

1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

4.For enterprises, more professional users

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STD MEMS_Connector

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Mode: Editors' pick

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Update time: 2020-03-18 13:41:17
Creation time: 2020-03-18 07:29:33
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ID Name Designator Footprint Quantity BOM_Supplier BOM_Supplier Part BOM_Manufacturer Part
1 100 R1 R1206 1 LCSC C351483 PTFR1206B1K00P9
2 0 R2,R3,R4,R5,R6,R7,R8,R9,R10,R11,R12,R13,R14,R15,R16 R1206 15 LCSC C351483 PTFR1206B1K00P9
3 Female header 2.54-1*14P H1 HDR-TH_14P-P2.54-V 1 LCSC C52711 Female header 2.54-1*14P
4 Header-Male-2.54_1x2 H2 HDR-2X1/2.54 1 LCSC C86471 826629-2
5 14-pin chip header U2 DILB14P-223TLF 1 Digi-Key 609-4712-ND DILB14P-223TLF
6 5227661-1 U1 RF-TH_5227661-1 1 LCSC C305920 5227661-1

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