© 2024 EasyEDA Some rights reserved ISO/IEC
1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD ESP8266 E201
Mode: Editors' pick
Схема
Open in EditorUPS
Open in EditorTP4056
Open in EditorRelay Blok
Open in EditorЩит
Open in EditorСхема_MCP23017_4n25
Open in EditorPCF8583
Open in Editor24Cxx
Open in EditorID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | 100nF | C1 | C1206 | 1 |
2 | PC817 | U4,U1 | DIP-4 | 2 |
3 | 500 | R1,R17 | AXIAL-0.3 | 2 |
4 | 300 | R2,R16 | AXIAL-0.3 | 2 |
5 | SS14 | D2,D1 | SMA_L4.4-W2.8-LS5.4-RD | 2 |
6 | PCF8583PN | U2,U3 | DIP8 | 2 |
7 | 10K | R3,R4,R6,R5 | R1206 | 4 |
8 | LTST-C150GKT | LED1,LED2 | LED1206-RD | 2 |
9 | 10nF | C3,C4 | C1206 | 2 |
10 | Z-211-0311-0021-001 | H1 | HDR-TH_3P-P2.54-V | 1 |
11 | 680uF | C2 | CAP-TH_BD8.0-P3.50-D1.0-FD | 1 |
12 | C70373 | BT1 | BAT-SMD_CR2032-3V | 1 |
13 | XY302V-3.5-3P | X2,X1,X3 | CONN-TH_XY302V-3.5-3P | 3 |
14 | 74HC132N | U5 | DIP14 | 1 |
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