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2.The process supports design scales of 300 devices or 1000 pads

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STD pcb1

License: Public Domain

Mode: Editors' pick

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Update time: 2019-11-08 00:12:24
Creation time: 2019-11-08 00:05:36
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ID Name Designator Footprint Quantity BOM_Supplier Part BOM_Supplier BOM_Manufacturer BOM_Manufacturer Part
1 1N4004W D1,D2,D5,D6 SOD-123F_L2.8-W1.8-LS3.7-RD 4 C162734 LCSC Jingdao 1N4004W
2 DB2EVC-3.81-5P CN3,CN4 CONN-TH_5PIN-V-PITCH3.81-L_DB2EVC-3.81-5P 2 C395701 LCSC DIBO DB2EVC-3.81-5P
3 A2541HWV-8P H3,H4 A2541HWV-8P 2 C225505 LCSC Changjiang Connectors A2541HWV-8P
4 6.8K R7,R8,R19,R20 1210 4 C105039 LCSC RALEC RTT12682JTP
5 DB2EVC-5.08-4P CN13,CN14,CN15 CONN-TH_4PIN-V-PITCH5.08-L_DB2EVC-5.08-4P 3 C395750 LCSC DIBO DB2EVC-5.08-4P
6 2.7K R1,R2,R23,R24 2010 4 C18480 LCSC UniOhm 2010W2J0272T4S
7 DB2EVC-5.08-2P CN1,CN2,CN5,CN6,CN9,CN10,CN11,CN12 CONN-TH_2PIN-V-PITCH5.08-L_DB2EVC-5.08-2P 8 C395734 LCSC DIBO DB2EVC-5.08-2P
8 DB2EVC-5.08-3P CN7,CN8 CONN-TH_3PIN-V-ROW1-COL3-PITCH5.08-L_DB2EVC-5.08-3P 2 C395743 LCSC DIBO DB2EVC-5.08-3P
9 MCP3208-CI/SL U3 SOIC-16_L9.9-W3.9-P1.27-LS6.0-BL 1 C16939 LCSC MICROCHIP MCP3208-CI/SL
10 NTJD5121NT2G Q1,Q9 SC-70-6(SOT-363) 2 C152477 LCSC ON NTJD5121NT2G
11 4.7K R10,R11,R17,R18 RES_1210 4 C40155 LCSC Uniroyal Elec 1210W2F4701T5E
12 180 R4,R5,R21,R22 1210 4 C326903 LCSC YAGEO RC1210JR-07180RL
13 4N35S-TA1 U1,U2,U5,U6 OPTO-SMD-6_L8.5-W6.5-P2.54-LS9.2-BL 4 C115444 LCSC LITEON 4N35S-TA1
14 MMBT3906 Q3,Q4,Q7,Q8 SOT-23(SOT-23-3) 4 C124753 LCSC PANJIT MMBT3906
15 DS1023-2*10SF11 H5,H6 HDR-TH_20P-P2.54-V-R2-C10-S2.54 2 C92266 LCSC CONNFLY DS1023-2*10SF11

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