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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD PLACA DE COMPONENTES (PATAS)

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Update time: 2019-09-18 10:53:40
Creation time: 2019-09-11 11:25:20
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ID Name Designator Footprint Quantity
1 330 R13,R14,R15 AXIAL-0.3 3
2 BC547 B4,G2,R11 TO92-INLINE 3
3 220 R20,R19,R18,R17,R16,R12 AXIAL-0.3 6
4 2N2222 TRANS12,TRANS11,TRANS10,TRANS9,TRANS8,TRANS7 NPN 6
5 Motores M2 LMA_BORNAS_WEIDMULLER_CI 1
6 DOIT ESP32 Devkit V1 IF ESP2 DOIT ESP32 DEVKIT V1 1
7 LM7805 R2V TO-220F(TO-220IS) 1
8 0,1u C4 CAP-D3.0XF1.5 1
9 0,33u C3 CAP-D3.0XF1.5 1
10 DC-005 5.5-2.0MM DC2 DC-IN-TH_DC-5520 1
11 2510S-4P LED1,BOTON1,BOTON2,ULTRASONIDO1,PANTALLA1 SIP-2.54MM-4P-BOOMELE-H11.5 5
12 2510R-8P CN1 2510R-8P 1

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