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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD Нагреватель 220 В

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Update time: 2019-10-08 12:06:25
Creation time: 2019-10-08 06:54:36
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ID Name Designator Footprint Quantity
1 TMP01 U1 SOIC-8 1
2 100k R5,R4 0603 2
3 DB107S VD3,D2 DB107S 2
4 2u2 C1 0805 1
5 IRLML2803 Q1,Q2 SOT-23_3PIN_L3.04-W2.64-PITCH0.95-BR 2
6 GS1M_C211746 VD2,VD1,VD5,VD10 SMA(DO-214AC) 4
7 9V D1 ONSC-SOD-123-2-425-04_V 1
8 56k R6,R7,R8,R9,R32,R33,R34,R35 2512 8
9 56 R10 2512 1
10 82 R11 2512 1
11 Светодиод красный SMD LED1 0805 1
12 10k R12,R13,R14,R15,R16,R17,R18,R19,R20,R21,R22,R23,R24,R25,R26,R27,R28,R29,R30,R31 2512 20
13 TO-2013BC-PG LED2 0805-DIODE 1
14 B72660M0171K072 R36,R37 RES-SMD_4032-L10.2-W8.0 2
15 82k R1 0603 1
16 16k R2 0603 1
17 110k R3 0603 1
18 Signal_Generator XFG1 NONE 1

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