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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2022-03-03 06:38:47
Creation time: 2019-10-18 11:21:48
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ID Name Designator Footprint Quantity
1 2u2 C1 0805 1
2 1N4007 D1,D2,D3,D4,D5,D6,D7,D8,D10,D11,D39,D40,D68,D69 DO-41 14
3 1.5KE91A D9 DO-201 1
4 1.5KE100CA D37 DO-201AD-DOB 1
5 BZX384-C5V6.115 D38 SOD-323 1
6 MF-R050 F1 MF-R050 1
7 Светодиод красный SMD LED1 0805 1
8 2SK1317-E Q1,Q2 TO-3P_L15.5-W4.6-P5.65-T 2
9 47K R1,R2,R3,R4 0805 4
10 10k R14,R15,R22,R24,R31 2512 5
11 56k R40 2512 1
12 82 R41 2512 1
13 560 R42 2512 1
14 100k R43,R44 0603 2
15 110k R45 0603 1
16 16k R46 0603 1
17 82k R47 0603 1
18 HR971169C RJ1,RJ2 HR971169C 2
19 Варистор B72207-S 271-K101 (S07K275), 275 В, 21 Дж RU1,RU5,RU6,RU7,RU8 S07K275 5
20 TMP01 U1 SOIC-8 1
21 Клеммы для печатной платы - ZFKDSA 2,5-5,08- 2 - 1932326 X1 КЛЕММЫ ДЛЯ ПЕЧАТНОЙ ПЛАТЫ - ZFKDSA 2,5-5,08- 2 1

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