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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
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Update time：
2020-08-16 14:37:15
Creation time：
2019-05-29 13:17:17
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| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | 1k | R24,R23,R22,R21 | 0603 | 4 |
| 2 | 2.4k | R4,R2,R6,R1 | 0603 | 4 |
| 3 | SCREWTERMINAL_5MM_6P | U10 | SCREW_TERMINAL_5MM_6P | 1 |
| 4 | LED-Green(0603) | LED1,LED2,LED4,LED3 | LED-0603 | 4 |
| 5 | 120k | R16,R12,R14,R11,R15,R8,R10,R13 | 2512 | 8 |
| 6 | HEADER 2.54 1x4 | P3 | HEADER 2.54 1X4P | 1 |
| 7 | ELQ3H4(TA)-G | U5 | SOP-16_L10.3-W4.4-P1.27-LS7.0-BL | 1 |
| 8 | MMBT3904LT1G | Q7,Q5,Q6,Q8 | SOT-23(SOT-23-3) | 4 |
| 9 | PCF8574N | U9 | DIP16 | 1 |
| 10 | 300K | R17,R20,R19,R18 | 0603 | 4 |
| 11 | PC817 | U1,U3,U2,U4 | DIP-4_W7.62MM | 4 |
| 12 | Solder Jumper | A1,A0,A2 | SOLDER JUMPER 3 PAD | 3 |
| 13 | HF32FA-G/012-HSL1 | K5,K7,K6,K8 | RELAYS-TH_HF32FA-G/XX-HXX1X(XXX) | 4 |
| 14 | BC848B | Q1,Q2,Q3,Q4 | SOT-23(SOT-23-3) | 4 |
| 15 | 100nF | C3,C5,C1,C2,C4 | 0603 | 5 |
| 16 | 1N4007 | D2,D4,D1,D3 | SOD-123F | 4 |
| 17 | 1x2_5mm Screw Terminals | U6,U7,U8,U11 | 1X2 5MM SCREW TERMINALS | 4 |
| 18 | 300 | R5,R25,R7,R3 | 0805 | 4 |
| 19 | G5Q-1A4-DC12 | K2,K1,K4,K3 | G5Q-1A4DC24 | 4 |
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