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2.The process supports design scales of 300 devices or 1000 pads

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STD BMSstTRY

License: LGPL

Mode: Editors' pick

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Update time: 2021-10-29 09:53:29
Creation time: 2021-02-17 01:13:25
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ID Name Designator Footprint Quantity BOM_Manufacturer Part
1 22000uF C1,C2,C3,C4,C5,C6,C7,C8 CAP-TH_BD18.0-P7.50-D1.2-FD 8 RL0J223MM400A00CV0
2 100nF C11,C12,C13,C14,C15,C25,C27,C28 C0402 8 CL05B104KO5NNNC
3 1uF C16,C17 C0402 2 CL05A105KA5NQNC
4 18pF C18,C19,C23,C24 C0603 4 CL10C180JB8NNNC
5 100nF C20 C0603 1 CC0603KRX7R9BB104
6 470pF C21,C22 C0603 2 0603B471K500NT
7 22uF C26,C29,C30 C0805 3 CL21A226MAQNNNE
8 XT30UPB-M CN1,CN2,CN3,CN4 CONN-TH_XT30UPB-M 4 XT30UPB-M
9 ZMM5V6 D1,D6,D8,D9 LL-34_L3.5-W1.5-RD 4 ZMM5V6
10 ESDCAN24-2BLY D7 SOT-23-3_L3.0-W1.7-P0.95-LS2.9-BR 1 ESDCAN24-2BLY
11 CESD5V0AP D10 SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR 1 CESD5V0AP
12 210SMT-2*5P Gold-plated black H1,H2 HDR-SMD_10P-P2.54-V-R2-C5-S7.3 2 210SMT-2*5P Gold-plated black
13 X6511WVS-03H-C60D48-R1 H3,H4 HDR-SMD_3P-P2.54-V-M-S4.8 2 X6511WVS-03H-C60D48-R1
14 JP JP2 SMD_JUMPER 1 SMD-Jumper
15 10uH L1 L1206 1 CMI321609X100KT
16 SE30150B Q1,Q2,Q3,Q4,Q5,Q6,Q7,Q8 TO-252-2_L6.6-W6.1-P4.57-LS9.9-BR-CW 8 SE30150B
17 390 R1,R2 R0402 2 RC0402FR-07390RL
18 100K R3,R4,R5,R6,R7,R11,R12,R13,R14,R15,R16,R17,R18,R19,R20,R21,R22,R23,R24,R25 R0402 20 0402WGF1003TCE
19 10K R8 R1206 1 1206W4F1002T5E
20 100 R9,R10 R0402 2 0402WGF1000TCE
21 TS-1187A-B-A-B SW1 SW-SMD_4P-L5.1-W5.1-P3.70-LS6.4 1 TS-1187A-B-A-B
22 MC74HC4052ADG U1 SOIC-16_L9.9-W3.9-P1.27-LS6.0-BL 1 MC74HC4052ADG
23 ATMEGA328PB-AU U2 TQFP-32_L7.0-W7.0-P0.80-LS9.0-BL 1 ATMEGA328PB-AU
24 MCP2515-I/SO U5 SOIC-18_L11.6-W7.5-P1.27-LS10.3-BL 1 MCP2515-I/SO
25 ACPL-244-560E U6,U7,U10,U11 SO-16_L10.3-W4.4-P1.27-LS7.0-BL 4 ACPL-244-560E
26 MCP2551T-I/SN U8 SOIC-8_150MIL 1 MCP2551T-I/SN
27 HT7750_C259922 U9 SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR 1 HT7750
28 16MHz X1,X2 OSC-SMD_4P-L3.2-W2.5-BL 2 X322516MLB4SI

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